제품개요

• Robot : Wafer Multi Transfer
  Process Method : Brush Cleaning . Ultra Sonic Cleaning
                                E-Flow System (co2) . Jet Nano Spray. MC Nozzle
  Other :  Wireless Portable Panel. Followed Semi Standard.
                OS: MA Windows Basd
                FA: SECSII . GEM Automation
  Max speed :  230 WPH
  Process Throughput :  Front, 4 Head Process Time 56/sec  200 WPH
                                          Both(2Front, 2Back), Process Time 56/sec  95 WPH
                                          Both(3Front, 3Back), Process Time 56/sec  141 WPH